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Bondjet BJ855

Wire Bonder by Hesse GmbH (5 more products)
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Product Specifications

Product Details

  • Part Number
    Bondjet BJ855
  • Manufacturer
    Hesse GmbH

General Parameters

  • Bond Time
    Up to 7 wire per sec
  • Bonding Method
    Ball Bonder, Wedge Bonder, Wire Bonder
  • Copper Wire Size
    12.5 to 75 µm
  • Motorized X and Y Travel
    305 x 410 mm
  • Motorized Z Travel
    19 mm
  • Net Weight
    1150 kg
  • Overall Dimensions
    740 x 1484 x 1912 mm
  • Power Supply
    230V AC
  • Ribbon Size
    35 x 6 µm up to 250 x 25 µm
  • Wire Feed Angle
    45 Degree, 60 Degree, 90 Degree
  • Wire Pitch
    40 µm

Technical Documents