HW585

Wire Bonder by HIGHLYWIN (2 more products)

Note : Your request will be directed to HIGHLYWIN.

HW585 Image

Product Specifications

Product Details

  • Part Number
    HW585
  • Manufacturer
    HIGHLYWIN

General Parameters

  • Bond Time
    40 ms/wire
  • Bonding Area
    56 x 90 mm
  • Bonding Method
    Wire Bonder
  • Copper Wire Size
    15 to 50 µm
  • Magazine Dimensions
    300 x 100 mm
  • Placement Accuracy
    ±2 µm

Technical Documents