1. Home
  2. Semiconductor Equipment
  3. Assembly & Packaging Equipment
  4. Wire Bonders
  5. HYBOND, Inc
  6. Model 676

Model 676

Wire Bonder by HYBOND, Inc (5 more products)
Download Datasheet Request Information

Note : Your request will be directed to HYBOND, Inc.

Model 676 Image

Product Specifications

Product Details

  • Part Number
    Model 676
  • Manufacturer
    HYBOND, Inc

General Parameters

  • Bond Froce
    12 to 250 g
  • Bond Time
    0 to 900 ms
  • Bonding Method
    Wedge Bonder, Wire Bonder
  • Gold Wire Size
    12.7 to 76 µm
  • Motorized Z Travel
    19 mm
  • Net Weight
    31.8 kg
  • Power Supply
    90-260 VAC 50/60 Hz @ 10A
  • Ribbon Size
    25.4 x 510 µm
  • Temperature Control
    Ambient to 250 Degree C
  • Ultrasonic Power
    0 to 0.2 W to, 0 to 2 W
  • Ultrasonic Frequency
    62.5 kHz

Technical Documents