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Thermosonic Ball Bonder (Au, Cu, Ag)

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Product Specifications

Product Details

  • Part Number
    Thermosonic Ball Bonder (Au, Cu, Ag)
  • Manufacturer
    Iwatani Corporation

General Parameters

  • Bond Time
    43 ms/wire
  • Bonding Area
    56 x 80 mm
  • Bonding Method
    Ball Bonder
  • Leadframe Dimensions
    295 x 90 mm
  • Magazine Dimensions
    305 x 110 x 175 mm
  • Net Weight
    550 kg
  • Overall Dimensions
    1200 x 1085 x 1728 mm
  • Placement Accuracy
    ±2.5 µm

Technical Documents