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iBond5000

Wire Bonder by Micro Point Pro (2 more products)
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Product Specifications

Product Details

  • Part Number
    iBond5000
  • Manufacturer
    Micro Point Pro

General Parameters

  • Bond Froce
    10 to 250 g
  • Bond Time
    10 to 100 ms, 10 to 1000 ms
  • Bonding Area
    135 x 135 mm
  • Bonding Method
    Wedge Bonder
  • Bonding Tool
    0.0750 to 1 Inches
  • Copper Wire Size
    17 to 50 µm
  • Fine Table Motion
    14 mm
  • Gold Wire Size
    17 to 75 µm
  • Gross Table Motion
    140 mm
  • Motorized X and Y Travel
    4 mm, 0.25 mm, 0.5 mm
  • Motorized Z Travel
    12.5 mm
  • Net Weight
    31 kg
  • Overall Dimensions
    680 x 700 x 530 mm
  • Power Supply
    100 - 240V, 50/60 Hz
  • Ribbon Size
    25 x 250 µm
  • Temperature Control
    Up to 250 Degree C
  • Throat Depth
    143 mm
  • Ultrasonic Power
    1.3 to 2.5 W
  • Ultrasonic Frequency
    60 kHz
  • Wire Feed Angle
    90 Degree
  • Wire Spool Size
    51 x 25 mm

Technical Documents