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COF Flip Eutectic Bonding Machine

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COF Flip Eutectic Bonding Machine Image

Product Specifications

Product Details

  • Part Number
    COF Flip Eutectic Bonding Machine
  • Manufacturer
    Shenzhen Liande Automation Equipment Co., Ltd

General Parameters

  • Bond Force
    10 to 350 N
  • Bonding Cycle Time
    1.5 sec
  • Bonding Method
    Die Bonder, Flip Chip Bonder
  • Chip Size
    25 x 5 mm
  • Substrate Thickness
    25 to 112 µm
  • Substrate Working Range
    35 mm, 48 mm, 70 mm
  • Temperature Uniformity
    200 to 450 Degree C
  • Type
    Automatic
  • Wafer Chip Thickness
    0.2 to 1 mm
  • Wafer Die attach Placement Speed
    2000 UPH
  • Wafer Size
    8 Inches, 12 Inches
  • X Y Placement Accuracy
    ±1.5 µm

Technical Documents
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