MDM-50

Note : Your request will be directed to TDK Corporation.

MDM-50 Image

Product Specifications

Product Details

  • Part Number
    MDM-50
  • Manufacturer
    TDK Corporation

General Parameters

  • Bonding Method
    Flip Chip Bonder
  • Net Weight
    600 kg
  • Overall Dimensions
    740 x 1140 x 1650 mm
  • Substrate Thickness
    2 mm
  • Substrate Working Range
    200 x 150 mm
  • Type
    Automatic
  • X Y Placement Accuracy
    ± 3 µm

Technical Documents