TO Series Soft Solder Die Bonder

Note : Your request will be directed to Shenzhen Liande Automation Equipment Co., Ltd.

TO Series Soft Solder Die Bonder Image

Product Specifications

Product Details

  • Part Number
    TO Series Soft Solder Die Bonder
  • Manufacturer
    Shenzhen Liande Automation Equipment Co., Ltd

General Parameters

  • Bond Force
    30 to 500 g
  • Bonding Method
    Die Bonder
  • Overall Dimensions
    2300 x 1380 x 1420 mm
  • Type
    Automatic
  • Wafer Size
    6 Inches, 8 Inches, 12 Inches
  • X Y Placement Accuracy
    =±40 µm

Technical Documents