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Eutectic Die Bonder

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Product Specifications

Product Details

  • Part Number
    Eutectic Die Bonder
  • Manufacturer
    Shenzhen Liande Automation Equipment Co., Ltd

General Parameters

  • Bond Force
    30 to 500 g
  • Bonding Method
    Die Bonder
  • Overall Dimensions
    760 x 610 x 1300
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    17000 to 18000 UPH
  • Wafer Size
    6 Inches, 8 Inches
  • X Y Placement Accuracy
    =±38 µm

Technical Documents
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