FC5000M

Note : Your request will be directed to Toray Engineering Co.,Ltd.

FC5000M Image

Product Specifications

Product Details

  • Part Number
    FC5000M
  • Manufacturer
    Toray Engineering Co.,Ltd

General Parameters

  • Bond Force
    0.1 to 3000 N
  • Bonding Method
    Flip Chip Bonder
  • Chip Size
    0.3 to 125 mm
  • Type
    Automatic
  • Wafer Size
    0.3 mm to PLP size
  • X Y Placement Accuracy
    2 µm

Technical Documents