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FPB-1w NeoForce

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FPB-1w NeoForce Image

Product Specifications

Product Details

  • Part Number
    FPB-1w NeoForce
  • Manufacturer
    Yamaha Motor Corporation

General Parameters

  • Bond Force
    0.3 to 350 N
  • Bonding Method
    Flip Chip Bonder
  • Bonding Stage Setting Temperature
    Room Temp to 200 Degree C
  • Bonding Tool Setting Temperature
    Room Temp to 400 Degree C
  • Chip Size
    1 to 22 mm
  • Compressed Air
    570 kPa 300 L/min
  • Net Weight
    3100 kg
  • Overall Dimensions
    2520 x 1620 x 1750 mm
  • Power Supply
    Single Phase AC200V–240V ±5%, 50/60 Hz, 14 kW
  • Type
    Automatic
  • Wafer Chip Thickness
    0.02 to 7 mm
  • Wafer Flip Chip Placement Speed
    6000 UPH
  • Wafer Size
    200 mm, 300 mm
  • X Y Placement Accuracy
    2.5 µm

Technical Documents
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