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STC-800

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Product Specifications

Product Details

  • Part Number
    STC-800
  • Manufacturer
    Yamaha Motor Corporation

General Parameters

  • Bond Head
    2 Heads
  • Bonding Cycle Time
    0.140 s/chip
  • Bonding Method
    Die Bonder
  • Chip Size
    0.12 to 1.5 mm
  • Compressed Air
    400 kPa (4kgf/cm2)
  • Net Weight
    1160 kg
  • Overall Dimensions
    1115 x 1130 x 2110 mm
  • Power Supply
    Single Phase AC 200V±5% 50/60 Hz, 2.0 kW
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    21400 UPH
  • Wafer Size
    8 Inches
  • Workpiece Size
    300 x 86 mm
  • X Y Placement Accuracy
    20 µm, 15 µm

Technical Documents
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