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YSB55w

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Product Specifications

Product Details

  • Part Number
    YSB55w
  • Manufacturer
    Yamaha Motor Corporation

General Parameters

  • Bond Head
    8 Heads
  • Bonding Method
    Flip Chip Bonder
  • Compressed Air
    4.5 bar
  • Net Weight
    3600 kg
  • Overall Dimensions
    2090 x 1866 x 1550 mm
  • Power Supply
    3-Phase AC 200/208/220/240/380/400/416V ±10% 50/60 Hz
  • Substrate Thickness
    0.2 to 3 mm
  • Substrate Working Range
    240 x 200 mm to 50 x 50 mm
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    13000 UPH
  • Wafer Die Attach Size
    2 to 30 mm
  • Wafer Size
    12 Inches
  • X Y Placement Accuracy
    ± 5 µm

Technical Documents
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