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P800

Thin Film Deposition Equipment by Beneq, Inc (9 more products)
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Product Specifications

Product Details

  • Part Number
    P800
  • Manufacturer
    Beneq, Inc

General Parameters

  • ALD Processes
    Thermal ALD
  • Integration
    Stand-Alone
  • Overall Dimensions
    3200 x 1340 x 2460 mm
  • Substrate Space Example
    550 x 310 x 700 mm, 730 x 1200 x 10 mm
  • Substrate Type
    Wafers, Glass or Metal Sheets, 3D and Freeform Parts
  • Temperature Range
    25 to 550 Degree C
  • Type
    ALD Process
  • Usage
    Production
  • Vaccum Chamber Dimensions
    800 mm

Technical Documents
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