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TFS 200

Thin Film Deposition Equipment by Beneq, Inc (9 more products)
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Product Specifications

Product Details

  • Part Number
    TFS 200
  • Manufacturer
    Beneq, Inc

General Parameters

  • ALD Processes
    Thermal ALD, Plasma-Enhanced ALD
  • Integration
    Stand-Alone, Cluster, Glovebox, Loadlock
  • Overall Dimensions
    1325 x 600 x 1298 mm
  • Substrate Type
    Up to 200 mm round wafers, Up to 200 x 200 mm square wafers, Wafer batch, 3D parts, Particles, Porous and high aspect ratio structures
  • Temperature Range
    25 to 500 Degree C
  • Type
    ALD Process
  • Usage
    Research & Development, Production
  • Vaccum Chamber Dimensions
    200 x 95 mm

Technical Documents
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