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Xceed MICRO

Wafer Automated Optical Inspection (AOI) Equipment by PARMI Co., Ltd (1 more product)
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Product Specifications

Product Details

  • Part Number
    Xceed MICRO
  • Manufacturer
    PARMI Co., Ltd

General Parameters

  • Bottom Clearance
    15 mm
  • Bottom Edge Clearance
    3.3 mm
  • Camera
    4 MP
  • Conveyor Height
    860 to 970 mm
  • Conveyor Speed
    300 to 800 mm/sec
  • Defects
    Die Tilt, Chipping, Misalignment, Crack, Epoxy Coverage, Runout Measurement, Bridge, Height, Area, Volume, Coplanarity, Cu Clip Height, Fillet Coverage, Bond Line Thickness, Die Position, Wire loop Height, Stitch, Contamination
  • Height Accuracy
    2 µm
  • Height Repeatability
    3 sigma < 3 µm
  • Light Source
    R.G.B LED 3 Stage Lightings
  • Max Component Height
    5 mm, 15 mm
  • Net Weight
    730 kg
  • Overall Dimensions
    850 x 1205 x 1525 mm
  • Resolution
    3.5 x 3.5 µm, 7 x 7 µm
  • Top Clearance
    30 mm
  • Top Edge Clearance
    2.5 mm
  • Type
    AOI for Semiconductor Packaging
  • Wafer Size
    410 x 350 mm
  • Wafer Thickness
    0.08 to 5 mm

Technical Documents
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