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TR7900Q SII

Wafer Automated Optical Inspection (AOI) Equipment by Test Research, Inc (1 more product)
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Product Specifications

Product Details

  • Part Number
    TR7900Q SII
  • Manufacturer
    Test Research, Inc

General Parameters

  • Bottom Clearance
    10 mm
  • Camera
    25 MP
  • Defects
    Missing Die, Orientation, Shift, Chipping, Crack, Scratch, Bond Line Thickness, Epoxy on Die, Epoxy Coverage, Epoxy Height, Broken Wire, Collapse, Loop Height, Cross Wire Gap, Wire Tracing
  • Light Source
    Multi-phase True Color LED
  • Magazine Size
    320 x 175 x 150 mm
  • Net Weight
    823 kg
  • Overall Dimensions
    2065 x 1490 x 1700 mm
  • Resolution
    2.5 µm
  • Top Clearance
    7 mm
  • Top Edge Clearance
    3 mm
  • Type
    Wafer Die Inspection & Wafer Wire Bond Inspection
  • Wafer Size
    285 x 150 mm
  • Wafer Thickness
    0.1 to 1.5 mm

Technical Documents
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