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MA6503D

Wafer Automated Optical Inspection (AOI) Equipment by Spirox Corporation
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Product Specifications

Product Details

  • Part Number
    MA6503D
  • Manufacturer
    Spirox Corporation

General Parameters

  • Accuracy
    1.7 µm
  • Defect Size
    5 µm
  • Defects
    Particles on Surface, Scratches, Pad Defect, Bump Defect, Pad PMI Inspection, Auto Pad Quick Selection, 3D Bump Height Measurement
  • Field of View
    24 x 300 mm
  • Magnification
    3X
  • Stage Flatness
    15 µm
  • Type
    Micro Inspection
  • Wafer Size
    8 Inches, 12 Inches
  • Wafer Thickness
    300 to 2000 µm
  • Z Resolution
    5 µm

Technical Documents
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