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AW-2001R

Wafer Etching System by Allwin21 Corp (3 more products)
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Product Specifications

Product Details

  • Part Number
    AW-2001R
  • Manufacturer
    Allwin21 Corp

General Parameters

  • Applications
    Plamsa Etching
  • Gases Control
    Up to 4 gas Line
  • Particulate
    0.05 p/cm2
  • Plasma Power
    Microwave
  • Process Chemistry Temperature
    60 to 110 Degree C (±2 Degree C)
  • Process Type
    Dry Etching
  • Uniformity
    ± 3%, ± 5%
  • Wafer Size
    2 to 6 Inches
  • Wafer Thickness
    50 µm

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