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AW-901eR

Wafer Etching System by Allwin21 Corp (3 more products)
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Product Specifications

Product Details

  • Part Number
    AW-901eR
  • Manufacturer
    Allwin21 Corp

General Parameters

  • Applications
    Plamsa Etching
  • Etching Speed
    0 to 8000 A/min
  • Gases Control
    Up to 4 gas Line
  • MTBF MTTA MTTR
    450 hr, 100 hr, 3.5 hr
  • Particulate
    0.05 p/cm2
  • Plasma Power
    13.56 MHz
  • Power Supply
    200-240 VAC, 50/60 Hz Single-Phase
  • Process Chemistry Temperature
    6 to 65 Degree C (±2 Degree C)
  • Process Type
    Dry Etching
  • Selectivity
    2 to 20:1
  • Substrates
    Polysilicon Nitride
  • Throughput
    30 to 60 wph
  • Uniformity
    3 to 5 %
  • Uptime
    0.95
  • Wafer Size
    3 to 6 Inches
  • Wafer Thickness
    50 µm

Technical Documents