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Wet Process Systems

Wafer Etching System by JST Manufacturing Inc
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Product Specifications

Product Details

  • Part Number
    Wet Process Systems
  • Manufacturer
    JST Manufacturing Inc

General Parameters

  • Process Type
    Wet Etching
  • Repeatability
    0.2 rpm
  • Rotation Speed
    1 to 6000 rpm
  • Substrates
    Silicon
  • Wafer Size
    Up to 300 mm

Technical Documents