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PlasmaPro 100

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PlasmaPro 100 Image

Product Specifications

Product Details

  • Part Number
    PlasmaPro 100
  • Manufacturer
    Oxford Instruments Plasma Technology

General Parameters

  • Applications
    Plamsa Etching
  • Process Type
    Wet Etching
  • Substrate Temperature
    -150 to 400 Degree C
  • Substrates
    SiNx, SiO2, PECVD, VCSEL, GaAs, AlGaAs
  • Wafer Size
    up to 200 mm

Technical Documents