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PlasmaPro 800 RIE

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Product Specifications

Product Details

  • Part Number
    PlasmaPro 800 RIE
  • Manufacturer
    Oxford Instruments Plasma Technology

General Parameters

  • Applications
    Plamsa Etching
  • Gases Control
    4 to 12 gas line
  • Process Type
    Dry Etching
  • Substrate Temperature
    Up to 400 Degree C
  • Substrates
    SiNx, SiO2, PECVD
  • Wafer Size
    300 mm

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