TEGAL

Wafer Etching System by Plasma-Therm

Note : Your request will be directed to Plasma-Therm.

TEGAL Image

Product Specifications

Product Details

  • Part Number
    TEGAL
  • Manufacturer
    Plasma-Therm

General Parameters

  • Applications
    Plamsa Etching
  • Gases Control
    Up to 4 process gases
  • Plasma Power
    300 W, 1000 W RF power
  • Process Type
    Dry Etching
  • Substrates
    a-Si, poly Si, SiNx, SiO2
  • Wafer Size
    75 to 200 mm

Technical Documents