SI 500

Wafer Etching System by Sentech Instruments GmbH

Note : Your request will be directed to Sentech Instruments GmbH.

SI 500 Image

Product Specifications

Product Details

  • Part Number
    SI 500
  • Manufacturer
    Sentech Instruments GmbH

General Parameters

  • Applications
    Plamsa Etching
  • Process Type
    Dry Etching
  • Substrate Temperature
    -20 to 250 Degree C
  • Substrates
    GaAs, InP, GaN, InSb, SiC, SiGe
  • Wafer Size
    Up to 200?mm

Technical Documents