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DAG810

Wafer Grinding Equipment by Disco Corporation (7 more products)
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Product Specifications

Product Details

  • Part Number
    DAG810
  • Manufacturer
    Disco Corporation

General Parameters

  • Grinding Method
    Anomalous In-Feed Grinding
  • Net Weight
    1300 kg
  • Overall Dimensions
    600 x 1700 x 1780 mm
  • Rated Output
    4.2 kW
  • Spindle Rated Torque
    5.9 Nm
  • Spindle Rotation Speed
    1000 to 7000 rpm
  • Wafer Size
    8 Inches
  • Wheel Size
    200 mm

Technical Documents