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DFG8560

Wafer Grinding Equipment by Disco Corporation (7 more products)
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Product Specifications

Product Details

  • Part Number
    DFG8560
  • Manufacturer
    Disco Corporation

General Parameters

  • Grinding Method
    Anomalous In-Feed Grinding
  • Net Weight
    4000 kg
  • Overall Dimensions
    1400 x 3190 x 1800 mm
  • Rated Output
    4.8 kW
  • Spindle Rotation Speed
    1000 to 4000 rpm
  • Wafer Size
    300 mm
  • Wheel Size
    300 mm

Technical Documents