DGP8761

Wafer Grinding Equipment by Disco Corporation (7 more products)

Note : Your request will be directed to Disco Corporation.

Product Specifications

Product Details

  • Part Number
    DGP8761
  • Manufacturer
    Disco Corporation

General Parameters

  • Grinding Method
    In-Feed Grinding
  • Net Weight
    6700 kg
  • Overall Dimensions
    1690 x 3315 x 1800 mm
  • Wafer Size
    300 mm
  • Wheel Size
    300 mm, 450 mm

Technical Documents