1. Home
  2. Semiconductor Equipment
  3. Wafer Manufacturing Equipment
  4. Wafer Grinding Equipment
  5. Disco Corporation
  6. DFG8340

DFG8340

Wafer Grinding Equipment by Disco Corporation (7 more products)
Download Datasheet Request Information

Note : Your request will be directed to Disco Corporation.

Product Specifications

Product Details

  • Part Number
    DFG8340
  • Manufacturer
    Disco Corporation

General Parameters

  • Grinding Method
    Anomalous In-Feed Grinding
  • Net Weight
    2500 kg
  • Overall Dimensions
    800 x 2450 x 1800 mm
  • Rated Output
    4.2 kW
  • Spindle Rotation Speed
    1000 to 7000 rpm
  • Wafer Size
    4 Inches, 5 Inches, 6 Inches, 8 Inches
  • Wheel Size
    200 mm

Technical Documents