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DFG8830

Wafer Grinding Equipment by Disco Corporation (7 more products)
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Product Specifications

Product Details

  • Part Number
    DFG8830
  • Manufacturer
    Disco Corporation

General Parameters

  • Grinding Method
    In-Feed Grinding
  • Net Weight
    6000 kg
  • Overall Dimensions
    1400 x 2500 x 2000 mm
  • Rated Output
    6.3 kW
  • Spindle Rotation Speed
    1000 to 4000 rpm
  • Wafer Size
    4 Inches, 5 Inches, 6 Inches, 8 Inches
  • Wheel Size
    300 mm

Technical Documents