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AC microLine 700 F

Wafer Grinding Equipment by Lapmaster Wolters GmbH (2 more products)
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Product Specifications

Product Details

  • Part Number
    AC microLine 700 F
  • Manufacturer
    Lapmaster Wolters GmbH

General Parameters

  • Center Drive Speed
    83 rpm
  • Max Load Pressure
    1000 daN, 1800 daN
  • Net Weight
    4000 kg
  • Overall Dimensions
    2200 x 1900 x 1900 mm
  • Rated Output
    2.5 kW
  • Spindle Rotation Speed
    300 rpm, 420 rpm
  • Thickness Gauge
    75 mm
  • Upper Lower Drive Power
    24 kW, 36 kW
  • Wafer Size
    200 mm
  • Wheel Size
    720 mm

Technical Documents