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5650HRi

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Product Specifications

Product Details

  • Part Number
    5650HRi
  • Manufacturer
    F&S Bondtec Semiconductor GmbH

General Parameters

  • Bond Froce
    Up to 1800 cN
  • Bond Speed
    1 Wire in 3 sec
  • Bondheads
    90 mm
  • Bonding Area
    100 x 100 mm
  • Bonding Method
    Wedge Bonder
  • Copper Wire Size
    300 to 500 µm
  • Loop Height Accuracy
    5 µm
  • Net Weight
    75 kg
  • Overall Dimensions
    700 x 650 x 700 mm
  • Placement Accuracy
    5 µm
  • Power Supply
    100-240 VAC, 1 Phase, 50/60 Hz, max 500 VA
  • Programmable Linear Z axis
    60 mm
  • Repeatability
    3 µm
  • Ribbon Size
    2000 x 300 µm
  • Step Resolution
    1 µm
  • Temperature Control
    0 to 250 Degree C
  • Ultrasonic Frequency
    60 kHz
  • Wire Spool Size
    4 Inches

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