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5810

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Product Specifications

Product Details

  • Part Number
    5810
  • Manufacturer
    F&S Bondtec Semiconductor GmbH

General Parameters

  • Bond Speed
    1 Wire in sec
  • Bondheads
    16 mm
  • Bonding Area
    200 x 150 mm
  • Bonding Method
    Ball Bonder, Wedge Bonder
  • Gold Wire Size
    12.5 to 50 µm
  • Loop Height Accuracy
    5 µm
  • Net Weight
    80 kg
  • Overall Dimensions
    920 x 710 x 650 mm
  • Placement Accuracy
    5 µm
  • Power Supply
    100-240 VAC, 1 Phase, 50/60 Hz, max 230 VA
  • Programmable Linear Z axis
    100 mm
  • Repeatability
    3 µm
  • Step Resolution
    1 µm
  • Temperature Control
    0 to 250 Degree C
  • Ultrasonic Frequency
    67 kHz
  • Wire Spool Size
    2 Inches

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