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8100 Image

Product Specifications

Product Details

  • Part Number
    8100
  • Manufacturer
    Palomar Technologies, Inc

General Parameters

  • Bond Froce
    5 to 200 g
  • Bond Time
    0.115 sec/wire, 0.075 sec/bump
  • Bonding Area
    330.2 x 152.4 mm
  • Bonding Method
    Ball Bonder
  • Capture Range
    760 to 1300 µm
  • Deep Access Capillary
    11.10 mm, 11.94 mm, 15.88 mm
  • Focus Range
    15.24 mm
  • Gold Wire Size
    17.8 to 50.8 µm
  • Net Weight
    875 kg
  • Overall Dimensions
    1737 x 1197 x 1073 mm
  • Placement Accuracy
    2.5 µm
  • Power Supply
    230 VAC +/- 10% (207-253), 50/60 Hz, 15AMP, Single Phase
  • Programmable Linear Z axis
    20 mm
  • Repeatability
    2.5 µm
  • Step Resolution
    0.1 µm
  • Wire Pitch
    50 µm using 20 µm wire
  • Wire Spool Size
    50.8 mm

Technical Documents