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HB02

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Product Specifications

Product Details

  • Part Number
    HB02
  • Manufacturer
    TPT Wire Bonder GmbH & Co KG

General Parameters

  • Bond Froce
    5 to 200 cN
  • Bond Time
    0 to 20000 ms
  • Bonding Method
    Wire Bonder, Wedge Bonder, Ribbon bonder
  • Bonding Tool
    19 mm
  • Fine Table Motion
    15 mm
  • Gold Wire Size
    17 to 75 µm
  • Net Weight
    25 kg
  • Overall Dimensions
    550 x 450 x 250 mm
  • Power Supply
    100-240 V +/-10 % 50/60 Hz 10 A max
  • Ribbon Size
    25 x 250 µm
  • Temperature Control
    250 Degree C
  • Throat Depth
    165 mm
  • Ultrasonic Power
    0 to 10 W
  • Ultrasonic Frequency
    63.3 kHz
  • Wire Feed Angle
    90 Degree
  • Wire Spool Size
    50.8 mm

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