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Wafer Laser Marking Machines - Page 2

36 Wafer Laser Marking Machines from 12 Manufacturers meet your specification.
WB-200AG Image
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E&R Engineering Corporation - WB-200AG

Wafer Laser Marking Machine from E&R Engineering Corporation
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Loading Stations:
Foup x 2 + FFC Cassette x 1
Marking Accuracy:
±50 µm
Marking Repeatability:
±25 µm
Thickness:
±150 µm
Throughput:
500 CPS
Wafer Size:
6 inches, 8 inches
more info
LSF20 Image
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HGLaser Engineering Co,.Ltd - LSF20

Wafer Laser Marking Machine from HGLaser Engineering Co,.Ltd
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Average Power:
20 W
Laser Type:
Fiber Laser
Marking Accuracy:
±0.1 mm
Overall Dimensions:
1250 x 900 x 1900 mm
Power Supply:
2.0 kW, AC 220V, 50 Hz
Temperature:
0 to 40 Degree C
Wafer Size:
150 x 150 mm
Wavelength:
1064 nm
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LSU5EB Image
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HGLaser Engineering Co,.Ltd - LSU5EB

Wafer Laser Marking Machine from HGLaser Engineering Co,.Ltd
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Average Power:
5 W
Laser Type:
UV Laser
Marking Accuracy:
±0.05 mm
Overall Dimensions:
1250 x 900 x 1900 mm
Power Supply:
2.0 kW, AC 220V, 50 Hz
Temperature:
35 Degree C
Wafer Size:
150 x 150 mm
Wavelength:
355 nm
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HD S2113 Image
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HGLaser Engineering Co,.Ltd - HD S2113

Wafer Laser Marking Machine from HGLaser Engineering Co,.Ltd
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Average Power:
5 W
Marking Accuracy:
± 0.03 mm
Net Weight:
2500 kg
Overall Dimensions:
1900 x 1800 x 1950 mm
Pulse Width:
10 ps
Wafer Size:
8 to 12 inches
more info
IL 2000 Image
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InnoLas Semiconductor GmbH - IL 2000

Wafer Laser Marking Machine from InnoLas Semiconductor GmbH
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Compressed Dry Air:
6 bar
Cooling Mode:
Cooling Water
Dot Depth:
0.1 to 100 µm
Dot Diameter:
25 to 150 µm
Exhaust:
33.6 m³/hr
Laser Stability:
±1%
Laser Type:
YAG 355, 532, 1064 & CO2
Loading Stations:
4
Marking Repeatability:
±75 µm
Net Weight:
750 kg
Overall Dimensions:
1275 x 1843 x 2027 mm
Power Supply:
230 V (1P/1N/1PE), 50 Hz, 16 Amps, 1200 W
Throughput:
180 wph
Wafer Size:
2 Inches to 200 mm
Water Pressure:
2 to 6 bar
Wavelength:
10.600 nm
more info
IL 1000 Image
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InnoLas Semiconductor GmbH - IL 1000

Wafer Laser Marking Machine from InnoLas Semiconductor GmbH
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Compressed Dry Air:
6 bar
Cooling Mode:
Cooling Water
Dot Depth:
0.1 to 100 µm
Dot Diameter:
25 to 150 µm
Exhaust:
33.6 m³/hr
Laser Stability:
±1%
Laser Type:
YAG 355, 532, 1064 & CO2
Loading Stations:
1
Marking Repeatability:
±75 µm
Net Weight:
600 kg
Overall Dimensions:
1429 x 920 x 2001 mm
Power Supply:
230 V (1P/1N/1PE), 50 Hz, 16 Amps, 1200 W
Throughput:
100 wph
Wafer Size:
2 Inches to 200 mm
Water Pressure:
2 to 6 bar
Wavelength:
10.600 nm
more info
IL 600 Image
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InnoLas Semiconductor GmbH - IL 600

Wafer Laser Marking Machine from InnoLas Semiconductor GmbH
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Compressed Dry Air:
6 bar
Cooling Mode:
Cooling Water
Dot Depth:
0.1 to 100 µm
Dot Diameter:
25 to 150 µm
Exhaust:
33.6 m³/hr
Laser Stability:
±1%
Laser Type:
YAG 355, 532, 1064 & CO2
Loading Stations:
1
Marking Repeatability:
±200 µm
Net Weight:
450 kg
Overall Dimensions:
1779 x 600 x 1997 mm
Power Supply:
230 V (1P/1N/1PE), 50 Hz, 16 Amps, 1000 W
Throughput:
60 wph
Wafer Size:
2 Inches to 200 mm
Water Pressure:
2 to 6 bar
Wavelength:
10.600 nm
more info
IL C3000 HT Image
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InnoLas Semiconductor GmbH - IL C3000 HT

Wafer Laser Marking Machine from InnoLas Semiconductor GmbH
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Compressed Dry Air:
6 bar
Cooling Mode:
Cooling Water
Dot Depth:
0.1 to 100 µm
Dot Diameter:
25 to 150 µm
Exhaust:
33.6 m³/hr
Laser Stability:
±1%
Laser Type:
YAG 355, 532, 1064 & CO2
Loading Stations:
Up to 3
Marking Repeatability:
±75 µm
Net Weight:
1500 kg
Overall Dimensions:
1648 x 2092 x 2196 mm
Power Supply:
230 V (1P/1N/1PE), 50 Hz, 16 Amps, 2000 W
Throughput:
180 wph
Wafer Size:
300 mm
Water Pressure:
2 to 6 bar
Wavelength:
10.600 nm
more info
IL C3000 Image
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InnoLas Semiconductor GmbH - IL C3000

Wafer Laser Marking Machine from InnoLas Semiconductor GmbH
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Compressed Dry Air:
6 bar
Cooling Mode:
Cooling Water
Dot Depth:
0.1 to 100 µm
Dot Diameter:
25 to 150 µm
Exhaust:
33.6 m³/hr
Laser Stability:
±1%
Laser Type:
YAG 355, 532, 1064 & CO2
Loading Stations:
Up to 3
Marking Repeatability:
±75 µm
Net Weight:
1200 kg
Overall Dimensions:
1648 x 2092 x 2196 mm
Power Supply:
230 V (1P/1N/1PE), 50 Hz, 16 Amps, 1500 W
Throughput:
160 wph
Wafer Size:
300 mm
Water Pressure:
2 to 6 bar
Wavelength:
10.600 nm
more info
IL 3000 Image
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InnoLas Semiconductor GmbH - IL 3000

Wafer Laser Marking Machine from InnoLas Semiconductor GmbH
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Compressed Dry Air:
6 bar
Cooling Mode:
Cooling Water
Dot Depth:
0.1 to 100 µm
Dot Diameter:
25 to 150 µm
Exhaust:
33.6 m³/hr
Laser Stability:
±1%
Laser Type:
YAG 355, 532, 1064 & CO2
Loading Stations:
4
Marking Repeatability:
±75 µm
Net Weight:
1200 kg
Overall Dimensions:
1425 x 2003 x 1920 mm
Power Supply:
230 V (1P/1N/1PE), 50 Hz, 16 Amps, 1500 W
Throughput:
160 wph
Wafer Size:
300 mm
Water Pressure:
2 to 6 bar
Wavelength:
10.600 nm
more info
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