FDB250

Note : Your request will be directed to Shibuya Corporation.

FDB250 Image

Product Specifications

Product Details

  • Part Number
    FDB250
  • Manufacturer
    Shibuya Corporation

General Parameters

  • Bond Force
    1 to 100 N
  • Bonding Method
    Flip Chip Bonder
  • Chip Size
    12 mm
  • Net Weight
    2000 kg
  • Overall Dimensions
    1985 x 2470 x 1950 mm
  • Substrate Working Range
    240 x 100 mm
  • Type
    Automatic
  • Wafer Size
    12 Inches
  • X Y Placement Accuracy
    ± 2 µm

Technical Documents