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CB-1800 Image

Product Specifications

Product Details

  • Part Number
    CB-1800
  • Manufacturer
    Airihatsu Automation Equipment Co., Ltd

General Parameters

  • Bond Force
    10 to 200 N
  • Bonding Method
    Flip Chip Bonder
  • Chip Size
    1 x 10 mm to 4 x 25 mm
  • Heated Bond Head
    RT to 250 Degree C
  • Net Weight
    2400 kg
  • Overall Dimensions
    2900 x 1500 x 1950 mm
  • Type
    Automatic
  • X Y Placement Accuracy
    ± 3 µm

Technical Documents