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CB-1810

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Product Specifications

Product Details

  • Part Number
    CB-1810
  • Manufacturer
    Airihatsu Automation Equipment Co., Ltd

General Parameters

  • Bond Force
    10 to 200 N
  • Bonding Method
    Flip Chip Bonder
  • Chip Size
    3 to 10 mm
  • Heated Bond Head
    RT to 250 Degree C
  • Net Weight
    2400 kg
  • Overall Dimensions
    1320 x 1800 x 1780 mm
  • Substrate Working Range
    50 x 80 to 80 x 200 mm
  • Type
    Automatic
  • Wafer Size
    50 x 80 mm to 80 x 200 mm
  • X Y Placement Accuracy
    ± 3 µm

Technical Documents
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