1. Home
  2. Semiconductor Equipment
  3. Assembly & Packaging Equipment
  4. Die Bonders
  5. Airihatsu Automation Equipment Co., Ltd
  6. CB-210

CB-210

Download Datasheet Request Information

Note : Your request will be directed to Airihatsu Automation Equipment Co., Ltd.

CB-210 Image

Product Specifications

Product Details

  • Part Number
    CB-210
  • Manufacturer
    Airihatsu Automation Equipment Co., Ltd

General Parameters

  • Bond Force
    1 to 100 N
  • Bonding Cycle Time
    10 sec/chip, 6 sec/chip
  • Bonding Method
    Flip Chip Bonder
  • Chip Size
    0.8 to 30 mm
  • Heated Bond Head
    RT to 250 Degree C
  • Net Weight
    120 kg
  • Overall Dimensions
    702 x 805 x 740 mm
  • Power Supply
    200 V
  • Substrate Working Range
    150 x 300 mm
  • Type
    Semi Automatic
  • X Y Placement Accuracy
    ± 2 µm, ± 5 µm

Technical Documents
View similar products