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CB-3000

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Product Specifications

Product Details

  • Part Number
    CB-3000
  • Manufacturer
    Airihatsu Automation Equipment Co., Ltd

General Parameters

  • Bond Head
    2 Heads
  • Bonding Cycle Time
    8000 chip/h
  • Bonding Method
    Flip Chip Bonder
  • Chip Size
    0.4 to 35 mm
  • Net Weight
    2200 kg
  • Overall Dimensions
    1800 x 1550 x 1650 mm
  • Power Supply
    AC200V, 50/60 Hz
  • Substrate Working Range
    50 to 330 x 220 mm
  • Type
    Automatic
  • Wafer Size
    8 Inches, 12 Inches
  • X Y Placement Accuracy
    ± 8 µm

Technical Documents
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