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CB-505

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Product Specifications

Product Details

  • Part Number
    CB-505
  • Manufacturer
    Airihatsu Automation Equipment Co., Ltd

General Parameters

  • Bond Force
    3 to 300 N
  • Bonding Method
    Manual Bonder
  • Chip Size
    30 to 40 mm
  • Heated Bond Head
    RT to 450 Degree C
  • Net Weight
    550 kg
  • Overall Dimensions
    1200 x 1000 x 1700 mm
  • Substrate Working Range
    10 to 100 mm
  • Type
    Manual
  • X Y Placement Accuracy
    ± 5 µm

Technical Documents
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