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CB-700

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Product Specifications

Product Details

  • Part Number
    CB-700
  • Manufacturer
    Airihatsu Automation Equipment Co., Ltd

General Parameters

  • Bond Force
    0.049 to 4.9 N
  • Bonding Method
    Flip Chip Bonder
  • Chip Size
    0.3 x 0.3 mm to 30 x 30 mm
  • Heated Bond Head
    RT to 450 Degree C
  • Net Weight
    4900 kg
  • Overall Dimensions
    1320 x 2120 x 1815 mm
  • Substrate Working Range
    200 x 200 mm
  • Type
    Automatic
  • Wafer Size
    8 Inches
  • X Y Placement Accuracy
    ± 0.5 µm

Technical Documents
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