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CoS

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Product Specifications

Product Details

  • Part Number
    CoS
  • Manufacturer
    ASMPT SEMI USA, Inc

General Parameters

  • Bond Force
    3 g up to 500 g
  • Bond Head
    2 Heads
  • Bonding Cycle Time
    5 to 10 sec
  • Bonding Method
    Die Bonder
  • Compressed Air
    6 bar
  • Heated Bond Head
    Up to 350 Degree C
  • Net Weight
    2800 kg
  • Overall Dimensions
    2094 x 1550 x 1973 mm
  • Power Supply
    400 V, 100 W
  • Substrate Working Range
    0.3 x 0.3 mm up to 16 x 16 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    0.15 x 0.15 mm up to 3 x 8 mm
  • Wafer Size
    300 x 300 mm, 200 x 300 mm
  • X Y Placement Accuracy
    ± 1.5 to 7 µm

Technical Documents
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