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NANO

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Product Specifications

Product Details

  • Part Number
    NANO
  • Manufacturer
    ASMPT SEMI USA, Inc

General Parameters

  • Bond Force
    3 g up to 2000 g
  • Bonding Cycle Time
    18 sec
  • Bonding Method
    Die Bonder, Flip Chip Bonder
  • Compressed Air
    5.5 bar
  • Heated Bond Head
    Up to 350 Degree C
  • Net Weight
    2600 kg
  • Overall Dimensions
    2000 x 1600 x 2400 mm
  • Power Supply
    400 V
  • Substrate Working Range
    Very Small Submounts to 300 mm
  • Type
    Automatic
  • Wafer Size
    300 x 300 mm
  • X Y Placement Accuracy
    ± 0.2 µm

Technical Documents
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