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Nova Plus

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Product Specifications

Product Details

  • Part Number
    Nova Plus
  • Manufacturer
    ASMPT SEMI USA, Inc

General Parameters

  • Bond Force
    Up to 5000 g
  • Bonding Cycle Time
    3 to 5 sec
  • Bonding Method
    Die Bonder, Flip Chip Bonder
  • Compressed Air
    5 bar
  • Field of View
    4.6 x 3.5 mm2
  • Heated Bond Head
    Up to 350 Degree C
  • Net Weight
    2100 kg
  • Overall Dimensions
    1240 x 2140 x 1980 mm
  • Power Supply
    400 V 3 Phase
  • Substrate Working Range
    550 x 600 mm
  • Type
    Automatic
  • Wafer Size
    300 x 300 mm
  • X Y Placement Accuracy
    ± 1 µm

Technical Documents
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