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Datacon 2200 evo hF

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Product Specifications

Product Details

  • Part Number
    Datacon 2200 evo hF
  • Manufacturer
    BE Semiconductor Industries N.V.

General Parameters

  • Bond Force
    0.5 to 500 N
  • Bonding Method
    Die Bonder
  • Chip Trays Waffle Pack
    51 x 51 mm, 102 x 102 mm
  • Heated Bond Head
    450 Degree C
  • Overall Dimensions
    1160 x 1225 x 1800 mm
  • Standard Bond Head
    0 Degree to 360 Degree rotation
  • Substrate Working Range
    300 x 175 mm
  • Theta Placement Accuracy
    ±0.15 Degree
  • Type
    Automatic
  • Wafer Die Attach Size
    0.17 to 50 mm
  • Wafer Die Thickness
    0.17 to 7 mm
  • Wafer Size
    2 to 12 Inches
  • X Y Placement Accuracy
    ± 10 µm

Technical Documents
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