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Datacon 2200 evo plus

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Product Specifications

Product Details

  • Part Number
    Datacon 2200 evo plus
  • Manufacturer
    BE Semiconductor Industries N.V.

General Parameters

  • Bond Force
    0.5 to 75 N programmable
  • Bonding Method
    Die Bonder
  • Chip Trays Waffle Pack
    51 x 51 mm, 102 x 102 mm
  • Frame Size
    FF070, FF105, FF108, FF123
  • Heated Bond Head
    Up to 450 Degree C
  • Net Weight
    1300 kg
  • Overall Dimensions
    1160 x 1225 x 1750 mm
  • Standard Bond Head
    0 Degree to 360 Degree rotation
  • Substrate Working Range
    325 x 200 mm
  • Theta Placement Accuracy
    ± 0.10 Degree
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    Up to 7000 UPH
  • Wafer Die Attach Size
    0.15 to 30 mm
  • Wafer Die Thickness
    >50 µm
  • Wafer Flip Chip Placement Speed
    Up to 2500 UPH/module
  • Wafer Flip Chip Size
    0.5 to 30 mm
  • Wafer Flip Chip Without Dipping Placement Speed
    Up to 3200 UPH/module
  • Wafer Size
    2 to 12 Inches
  • X Y Placement Accuracy
    ± 7 µm

Technical Documents
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