Datacon 8800 CHAMEO advanced

Note : Your request will be directed to BE Semiconductor Industries N.V..

Datacon 8800 CHAMEO advanced Image

Product Specifications

Product Details

  • Part Number
    Datacon 8800 CHAMEO advanced
  • Manufacturer
    BE Semiconductor Industries N.V.

General Parameters

  • Bond Force
    0.5 to 50 N
  • Bonding Method
    Flip Chip Bonder
  • Field of View
    12 x 12 mm
  • Overall Dimensions
    1600 x 1200 x 1880 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    0.3 to 30 mm
  • Wafer Die Thickness
    50 µm to 3 mm
  • Wafer Flip Chip Placement Speed
    6000 UPH
  • Wafer Flip Chip Without Dipping Placement Speed
    Up to 9000 UPH
  • X Y Placement Accuracy
    ± 5 µm at 3 sigma

Technical Documents