Datacon 8800 FC QUANTUM advanced

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Datacon 8800 FC QUANTUM advanced Image

Product Specifications

Product Details

  • Part Number
    Datacon 8800 FC QUANTUM advanced
  • Manufacturer
    BE Semiconductor Industries N.V.

General Parameters

  • Bond Force
    200 to 5000 g
  • Bonding Method
    Flip Chip Bonder
  • Field of View
    12 x 12 mm
  • Net Weight
    2000 kg
  • Overall Dimensions
    1600 x 1200 x 1940 mm
  • Substrate Working Range
    330 x 203 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    0.3 to 20 mm
  • Wafer Die Thickness
    50 µm to 3 mm
  • Wafer Flip Chip Placement Speed
    Up to 10000 UPH
  • Wafer Size
    4 to 12 Inches
  • X Y Placement Accuracy
    ± 5 µm at 3 sigma

Technical Documents